Invention Grant
- Patent Title: Lid design for reliability enhancement in flip chip package
- Patent Title (中): 封装设计，用于倒装芯片封装的可靠性提升
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Application No.: US13007249Application Date: 2011-01-14
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Publication No.: US08976529B2Publication Date: 2015-03-10
- Inventor: Wen-Yi Lin , Po-Yao Lin , Tsung-Shu Lin , Kuo-Chin Chang , Shou-Yi Wang
- Applicant: Wen-Yi Lin , Po-Yao Lin , Tsung-Shu Lin , Kuo-Chin Chang , Shou-Yi Wang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/16 ; H01L23/055 ; H01L23/00
Abstract:
In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.
Public/Granted literature
- US20120182694A1 Lid Design for Reliability Enhancement in Flip Chip Package Public/Granted day:2012-07-19
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