A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device package is disposed on the first surface. The terminal module disposed on the first surface has a plurality of first and second contact parts, and each of the first contact parts passes through the corresponding via-hole and is protruded out of the second surface, and each of the second contact parts is electrically connected to the corresponding first pad. An orthogonal projection area of the electronic device package on the first surface is smaller than an area of the first surface.