Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13487775Application Date: 2012-06-04
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Publication No.: US08976537B2Publication Date: 2015-03-10
- Inventor: Takeshi Ito
- Applicant: Takeshi Ito
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-200526 20110914
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K3/30 ; H05K7/12 ; H05K3/32

Abstract:
A spring washer sandwiched between flat washers is interposed between a land on one surface of a printed circuit board of a control board part and an attachment plate, and a screw is inserted from the other surface of the printed circuit board through a substrate through hole extending through the printed circuit board, one of the flat washers, the spring washer, and the other flat washer and is screwed into a screw hole formed in the attachment plate, thereby fixing the attachment plate to the printed circuit board.
Public/Granted literature
- US20130063921A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-03-14
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