Invention Grant
- Patent Title: Optical printed circuit board and method for manufacturing the same
- Patent Title (中): 光学印刷电路板及其制造方法
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Application No.: US13997396Application Date: 2011-12-21
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Publication No.: US08977078B2Publication Date: 2015-03-10
- Inventor: Hyoun Jeong Lee
- Applicant: Hyoun Jeong Lee
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2010-0134545 20101224
- International Application: PCT/KR2011/009911 WO 20111221
- International Announcement: WO2012/087014 WO 20120628
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/125 ; G02B6/43 ; H05K1/02

Abstract:
An optical printed circuit board according to the embodiment includes an insulating layer; an optical wave guide buried in the insulating layer to transmit an optical signal; and an optical path converting part provided on at least one end of the optical wave guide to convert a transmission path of the optical signal defined by the optical wave guide such that the transmission path has a predetermined curvature.
Public/Granted literature
- US20130322814A1 OPTICAL PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-12-05
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