Invention Grant
- Patent Title: Electronic apparatus
- Patent Title (中): 电子仪器
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Application No.: US14337954Application Date: 2014-07-22
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Publication No.: US08977329B1Publication Date: 2015-03-10
- Inventor: Katsumi Arao , Akito Iwai
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: JP2014-034940 20140226
- Main IPC: H04M1/00
- IPC: H04M1/00 ; G06F1/16 ; H04M1/02 ; H05K1/00
Abstract:
A cover panel is disposed on a surface of an electronic apparatus and is made of sapphire. A flexible printed wiring board extends in a state of being curved in the electronic apparatus. A gap reduction member is in contact with at least a curved portion of the flexible printed wiring board from the cover panel side.
Information query
