Invention Grant
- Patent Title: Substrate cleaning method and substrate cleaning apparatus
- Patent Title (中): 基板清洗方法和基板清洗装置
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Application No.: US13486084Application Date: 2012-06-01
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Publication No.: US08980013B2Publication Date: 2015-03-17
- Inventor: Kousuke Yoshihara , Yuichi Yoshida , Taro Yamamoto
- Applicant: Kousuke Yoshihara , Yuichi Yoshida , Taro Yamamoto
- Applicant Address: JP Tokyo-To
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo-To
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-096725 20080403
- Main IPC: B08B3/08
- IPC: B08B3/08 ; G03F7/16 ; B08B3/02 ; G03F7/30 ; H01L21/67
Abstract:
A substrate cleaning method that includes: a step in which, while a substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a shortest distance between an edge of a cleaning liquid flow output from the cleaning-liquid nozzle and an edge of a gas flow output from the gas nozzle is set between 9 mm and 15 mm.
Public/Granted literature
- US20120234362A1 SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS Public/Granted day:2012-09-20
Information query
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