Invention Grant
- Patent Title: Electronic circuit board case
- Patent Title (中): 电子电路板盒
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Application No.: US13742447Application Date: 2013-01-16
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Publication No.: US08981240B2Publication Date: 2015-03-17
- Inventor: Hiroki Chitaka , Mitsuteru Suzaki
- Applicant: DENSO Corporation
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Priority: JP2012-36618 20120222
- Main IPC: H01R13/502
- IPC: H01R13/502 ; H05K5/00 ; H01R13/46 ; H05K7/18 ; H05K5/02
Abstract:
A case body portion accommodates an electronic circuit board. The case body portion has a rib projected from at least a part of a periphery of the opening. A lid has a flange, which is in contact with an outer periphery of the rib, when the lid is mounted on the case body portion to cover the opening. The rib has a raised portion raised outward from a part of an outer periphery of the rib.
Public/Granted literature
- US20130213708A1 ELECTRONIC CIRCUIT BOARD CASE Public/Granted day:2013-08-22
Information query
