Invention Grant
US08982169B2 Fine wiring pattern and composition, manufacturing method thereof, and thermal print head including fine wiring pattern
有权
精细的布线图案及其组成，制造方法和包括精细布线图案的热打印头
- Patent Title: Fine wiring pattern and composition, manufacturing method thereof, and thermal print head including fine wiring pattern
- Patent Title (中): 精细的布线图案及其组成，制造方法和包括精细布线图案的热打印头
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Application No.: US13747703Application Date: 2013-01-23
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Publication No.: US08982169B2Publication Date: 2015-03-17
- Inventor: Shinobu Obata , Koji Nishi , Takafumi Katsuno , Masumi Okumura , Nobuhito Kinoshita
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2012-12936 20120125; JP2012-120888 20120528
- Main IPC: B41J2/335
- IPC: B41J2/335 ; B41J2/045 ; H05K3/06 ; H05K1/09 ; H05K3/12 ; H05K1/03
Abstract:
According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
Public/Granted literature
- US20130215200A1 FINE WIRING PATTERN, MANUFACTURING METHOD THEREOF, AND THERMAL PRINT HEAD Public/Granted day:2013-08-22
Information query
IPC分类:
