Invention Grant
US08982576B2 Printed wiring board, and method of supplying power and forming wiring for printed wiring board
有权
印刷电路板，印刷电路板的电源供给方法以及布线的形成方法
- Patent Title: Printed wiring board, and method of supplying power and forming wiring for printed wiring board
- Patent Title (中): 印刷电路板，印刷电路板的电源供给方法以及布线的形成方法
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Application No.: US13821895Application Date: 2011-08-30
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Publication No.: US08982576B2Publication Date: 2015-03-17
- Inventor: Kazuhiro Kashiwakura
- Applicant: Kazuhiro Kashiwakura
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2010-210462 20100921
- International Application: PCT/JP2011/070096 WO 20110830
- International Announcement: WO2012/039269 WO 20120329
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K1/02
Abstract:
Provided is a printed wiring board including a power source, a plurality of LSIs, and a planar power supply wiring for supplying power from the power source to the LSIs. A plurality of partial wiring patterns each forming a current path from the power source to the LSIs are provided by forming gaps in the power supply wiring.
Public/Granted literature
- US20130170155A1 PRINTED WIRING BOARD, AND METHOD OF SUPPLYING POWER AND FORMING WIRING FOR PRINTED WIRING BOARD Public/Granted day:2013-07-04
Information query
