Invention Grant
- Patent Title: Supporting assembly for electronic device
- Patent Title (中): 电子设备支撑组件
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Application No.: US13415360Application Date: 2012-03-08
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Publication No.: US08985545B2Publication Date: 2015-03-24
- Inventor: Chuan-Hsiao Chiu , Chen-Ming Chan , Xiang-Lin Xue
- Applicant: Chuan-Hsiao Chiu , Chen-Ming Chan , Xiang-Lin Xue
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: Rabin & Berdo, P.C.
- Priority: CN201110301514 20110928
- Main IPC: A47B91/00
- IPC: A47B91/00 ; F16M13/00 ; G06F1/16 ; H05K5/02 ; G06F1/18

Abstract:
A supporting assembly is disposed to a case of an electronic device. A window is formed on the case for communicating an inner surface and an outer surface of the case. The supporting assembly includes a fixed part, a latching post, and a support body. The fixed part is disposed to the inner surface. The latching post includes a fixing end and an inserting end. The fixing end runs through the window and is fixed to the fixed part. A first stopping block is disposed to the inserting end. The support body includes a supporting side and a combination side. A combination hole is formed at the combination side for the inserting end to insert therein. The support body further includes a second stopping block protrudly disposed in the combination hole, for stopping the first stopping block to prevent the inserting end from escaping from the combination hole.
Public/Granted literature
- US20130075550A1 SUPPORTING ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2013-03-28
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