Invention Grant
- Patent Title: Liquid ejection head and liquid ejection apparatus
- Patent Title (中): 液体喷射头和液体喷射装置
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Application No.: US13747851Application Date: 2013-01-23
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Publication No.: US08985749B2Publication Date: 2015-03-24
- Inventor: Eiichiro Watanabe
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2012-012491 20120124
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14

Abstract:
A liquid ejection head includes a flow path unit having pressure generating chambers, a case head that is mounted to the flow path unit, and a piezoelectric element unit having a fixation member and piezoelectric elements, an adhesive surface of the fixation member being adhered to the case head by using a first adhesive and a second adhesive, and the piezoelectric elements being bonded to a piezoelectric element attachment surface of the fixation member which intersects the adhesive surface and also attached to islands that oppose the pressure generating chambers of the flow path unit, wherein the second adhesive has curing time shorter than that of the first adhesive, and the first adhesive has adhesion strength higher than that of the second adhesive and is applied on a first adhesive surface on the adhesive surface of the fixation member which is subject to a reaction force of the piezoelectric elements.
Public/Granted literature
- US20130187991A1 LIQUID EJECTION HEAD AND LIQUID EJECTION APPARATUS Public/Granted day:2013-07-25
Information query
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