Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method and storage medium
- Patent Title (中): 基板处理装置,基板处理方法和存储介质
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Application No.: US13611555Application Date: 2012-09-12
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Publication No.: US08985929B2Publication Date: 2015-03-24
- Inventor: Suguru Enokida , Masahiro Nakaharada , Akira Miyata , Hidekazu Kiyama , Naruaki Iida
- Applicant: Suguru Enokida , Masahiro Nakaharada , Akira Miyata , Hidekazu Kiyama , Naruaki Iida
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2011-208097 20110922; JP2011-208100 20110922
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/687

Abstract:
A substrate processing apparatus includes: a carrier block including first and second carrier placement units spaced apart in a right and left direction; a processing block having a layered structure in which a plurality of layered parts are vertically arranged, the layered parts each including a substrate transport mechanism for transporting a substrate and a processing module for processing a substrate; a tower unit including plural substrate placement units located at height positions where a substrate is transferred by the substrate transport mechanism of the layered part corresponding to the substrate placement unit; a first substrate transfer mechanism configured to transfer a substrate between the carrier on the first carrier placement unit and the substrate placement unit of the tower unit; and a second substrate transfer mechanism configured to transfer a substrate between the carrier on the second substrate placement unit and the substrate placement unit of the tower unit.
Public/Granted literature
- US20130078059A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM Public/Granted day:2013-03-28
Information query
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