Invention Grant
- Patent Title: Square RF electrical contact and method of manufacturing the same
- Patent Title (中): 方形射频电接点及其制造方法
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Application No.: US12117888Application Date: 2008-05-09
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Publication No.: US08986042B2Publication Date: 2015-03-24
- Inventor: John Mongold
- Applicant: John Mongold
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H01R13/11 ; H01R24/50 ; H01R43/16 ; H01R103/00

Abstract:
An electrical contact includes a female portion having a conductive sheath, a dielectric disposed within the conductive sheath, and a center conductor extending through the dielectric; and a male portion having a conductive sheath, a dielectric disclosed within the conductive sheath, and a center conductor extending through the dielectric. The female portion and the male portion are arranged to be engageable with one another. The conductive sheath, center conductor, and dielectric of each of the female portion and the male portion have a substantially square shape. Each of the center conductors of the female portion and the male portion includes a contact portion. The contact portions of the female and male portions are arranged to be engaged with one another when the female portion and the male portion are engaged with one another. The contact portion of each of the center conductors of the female portion and the male portion has a thickness of substantially half of a thickness of the remaining portions of the center conductors.
Public/Granted literature
- US20090280681A1 SQUARE RF ELECTRICAL CONTACT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-11-12
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