Invention Grant
- Patent Title: Microdermabrasion system upgrade kit
- Patent Title (中): Microdermabrasion系统升级套件
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Application No.: US12197075Application Date: 2008-08-22
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Publication No.: US08986323B2Publication Date: 2015-03-24
- Inventor: N. Brendon Boone, III , Basil M. Hantash , Kenneth B. Karasiuk
- Applicant: N. Brendon Boone, III , Basil M. Hantash , Kenneth B. Karasiuk
- Applicant Address: US CA Westlake Village
- Assignee: Envy Medical, Inc.
- Current Assignee: Envy Medical, Inc.
- Current Assignee Address: US CA Westlake Village
- Agency: Aka Chan LLP
- Main IPC: A61B17/50
- IPC: A61B17/50 ; A61B17/54 ; A61B17/32
Abstract:
A microdermabrasion system upgrade kit includes a plurality of couplers from which a user may choose one or more couplers in order to connect the upgrade kit to a vacuum source of an existing microdermabrasion system. In an implementation, the upgrade kit includes a power socket that the user can plug the vacuum source into.
Public/Granted literature
- US20100049210A1 Microdermabrasion System Upgrade Kit Public/Granted day:2010-02-25
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