Invention Grant
US08986782B2 Method of forming self-assembly and uniform fullerene array on surface of substrate
有权
在基体表面形成自组装和均匀富勒烯阵列的方法
- Patent Title: Method of forming self-assembly and uniform fullerene array on surface of substrate
- Patent Title (中): 在基体表面形成自组装和均匀富勒烯阵列的方法
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Application No.: US12386915Application Date: 2009-04-24
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Publication No.: US08986782B2Publication Date: 2015-03-24
- Inventor: Mon-Shu Ho , Chih-Pong Huang
- Applicant: Mon-Shu Ho , Chih-Pong Huang
- Agency: Seyfarth Shaw LLP
- Main IPC: B32B5/16
- IPC: B32B5/16 ; C23C16/00 ; C23C14/34 ; C23C14/02 ; B82Y30/00 ; B82Y40/00 ; C01B31/02 ; C23C14/06 ; H01J1/304 ; H01J9/02

Abstract:
The present invention provides a method of forming a self-assembly fullerene array on the surface of a substrate, comprising the following steps: (1) providing a substrate; (2) pre-annealing the substrate at a temperature ranging from 200° C. to 1200° C. in a vacuum system; and (3) providing powdered fullerene nanoparticles and depositing them on the surface of the substrate by means of physical vapor deposition technology in the vacuum system, so as to form a self-assembly fullerene array on the surface of the substrate. The present invention also provides a fullerene embedded substrate prepared therefrom, which has excellent field emission properties and can be used as a field emitter for any field emission displays.Finally, the present invention provides a fullerene embedded substrate prepared therefrom, which can be used to substitute for semiconductor carbides as optoelectronic devices and high-temperature, high-power, or high-frequency electric devices.
Public/Granted literature
- US20100272985A1 Method of forming self-assembly and uniform fullerene array on surface of substrate Public/Granted day:2010-10-28
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