A warpage control stiffener ring package includes a substrate having an upper surface and corners. A segmented stiffener ring is formed of “L” shaped segments, each segment being mounted to the upper surface at a corner of the substrate, wherein a gap exists between each of the segments. By forming the segmented stiffener ring of segments having gaps therebetween, warpage of the segmented stiffener ring itself, and thus the thermal stress applied by the segmented stiffener ring on to the substrate, is reduced as compared to a continuous stiffener ring. This allows the segmented stiffener ring to be designed to minimize warpage of the warpage control stiffener ring package.