Invention Grant
- Patent Title: MEMS package and a method for manufacturing the same
- Patent Title (中): MEMS封装及其制造方法
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Application No.: US12856101Application Date: 2010-08-13
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Publication No.: US08987030B2Publication Date: 2015-03-24
- Inventor: Peter V. Loeppert , Denise P. Czech , Lawrence A. Grunert , Kurt B. Friel , Qing Wang
- Applicant: Peter V. Loeppert , Denise P. Czech , Lawrence A. Grunert , Kurt B. Friel , Qing Wang
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Lathrop & Gage LLP
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/56 ; B81B7/00
Abstract:
A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.
Public/Granted literature
- US20110039372A1 MEMS PACKAGE AND A METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-02-17
Information query
IPC分类:
