Invention Grant
- Patent Title: Method for manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13910607Application Date: 2013-06-05
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Publication No.: US08987125B2Publication Date: 2015-03-24
- Inventor: Hiroyuki Okazaki , Takuma Nanjo , Yosuke Suzuki , Akifumi Imai , Muneyoshi Suita , Eiji Yagyu
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-151680 20120705; JP2013-077408 20130403
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L21/285 ; H01L29/423 ; H01L29/20

Abstract:
The present invention relates to a method for manufacturing a heterojunction semiconductor device including an AlGaN layer, the method including the steps of (a) forming a dummy electrode in a region where a gate electrode is arranged on the AlGaN layer, (b) depositing a dielectric film on the AlGaN layer by exposing side surfaces of the dummy electrode, using a device having anisotropy, (c) forming an opening in the dielectric film by removing the dummy electrode, and (d) forming the gate electrode that extends from inside the opening onto the dielectric film in a vicinity of the opening.
Public/Granted literature
- US20140011349A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-01-09
Information query
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