Invention Grant
US08987899B2 Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device
有权
电路基板，半导体元件，半导体装置，电路基板的制造方法，半导体元件的制造方法以及半导体装置的制造方法
- Patent Title: Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device
- Patent Title (中): 电路基板，半导体元件，半导体装置，电路基板的制造方法，半导体元件的制造方法以及半导体装置的制造方法
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Application No.: US13357046Application Date: 2012-01-24
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Publication No.: US08987899B2Publication Date: 2015-03-24
- Inventor: Hiroshi Asami
- Applicant: Hiroshi Asami
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2011-017407 20110131
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H05K1/11 ; H05K3/34 ; H05K3/28 ; H01L23/00
Abstract:
A circuit board includes: an electrode portion which has a copper layer, a copper oxide layer formed thereon, and a removal portion formed by partially removing the copper oxide layer so as to partially expose the copper layer from the copper oxide layer; and a solder bump for flip chip mounting formed on the copper layer exposed by the removal portion.
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