Invention Grant
- Patent Title: Wireless communication apparatus with physical layer processing module and MAC layer processing module and its communication method
- Patent Title (中): 具有物理层处理模块和MAC层处理模块的无线通信装置及其通信方法
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Application No.: US13710995Application Date: 2012-12-11
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Publication No.: US08989811B2Publication Date: 2015-03-24
- Inventor: Masahiro Sekiya , Daisuke Taki
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Priority: JP2009-150040 20090624
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04B7/00 ; H04B7/005 ; H04W72/12

Abstract:
A wireless communication apparatus includes a first module, a second module, an inhibit module, a calculation module, and a control module. The first module constitutes a first system. The first system transmits and receives first data to and from a first device. The second module constitutes a second system. The second system transmits and receives second data to and from a second device in each interval time-divided with determined transmission timing. The inhibit module generates inhibit periods for preventing the first module from communicating by use of the first data. The calculation module calculates an occupation time required for the transmission and reception of the first data. The control module compares the period between the inhibit periods adjacent to one another with the occupation time and, according to the comparison result, instructs the first device to stop or delay the transmission of the first data.
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