Invention Grant
- Patent Title: Modular integrated circuit with common interface
- Patent Title (中): 具有通用接口的模块化集成电路
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Application No.: US13690019Application Date: 2012-11-30
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Publication No.: US08990471B2Publication Date: 2015-03-24
- Inventor: Mark N. Fullerton , Robert Morris , Lance Leslie Flake , Lawrence J. Madar, III , Sam Liu , Chaoyang Zhao , Vinay Bhasin , Joyjit Nath , Bhupesh Kharwa , Claude G. Hayek
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick & Markison
- Agent Bruce E. Stuckman
- Main IPC: G06F13/20
- IPC: G06F13/20 ; G06F13/28 ; G06F1/10 ; G06F1/26 ; G06F13/40 ; G06F13/36 ; H04K1/10
Abstract:
A modular integrated circuit includes a hub module that is coupled to a plurality of spoke modules via a plurality of hub interfaces. The plurality of hub interfaces provide a plurality of signal interfaces between the hub module and each of the plurality of spoke modules, wherein each of the plurality of signal interfaces is isolated from each of the other signal interfaces of the plurality of signals interface, and wherein each of the plurality of signal interfaces operates in accordance with a common signaling format.
Public/Granted literature
- US20130091316A1 MODULAR INTEGRATED CIRCUIT WITH COMMON INTERFACE Public/Granted day:2013-04-11
Information query
