Invention Grant
US08995066B2 Passive position compensation of a spindle, stage, or component exposed to a heat load
有权
主轴，平台或暴露于热负荷的部件的被动位置补偿
- Patent Title: Passive position compensation of a spindle, stage, or component exposed to a heat load
- Patent Title (中): 主轴，平台或暴露于热负荷的部件的被动位置补偿
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Application No.: US13226492Application Date: 2011-09-06
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Publication No.: US08995066B2Publication Date: 2015-03-31
- Inventor: Paul Doyle , Alexander Belyaev
- Applicant: Paul Doyle , Alexander Belyaev
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agent Deborah Wenocur
- Main IPC: G02B7/00
- IPC: G02B7/00 ; G01N21/95
Abstract:
Disclosed herein is an apparatus for providing passive correction for thermal effects on a mounted mechanical component. Further disclosed is a wafer inspection system employing the passive thermal effect correction apparatus.
Public/Granted literature
- US20130057855A1 PASSIVE POSITION COMPENSATION OF A SPINDLE, STAGE, OR COMPONENT EXPOSED TO A HEAT LOAD Public/Granted day:2013-03-07
Information query
IPC分类:
| G | 物理 |
| G02 | 光学 |
| G02B | 光学元件、系统或仪器 |
| G02B7/00 | 光学元件的安装、调整装置或不漏光连接 |
