Invention Grant
- Patent Title: Assembly including a compression-molded, composite panel with a hinged mounting flange
- Patent Title (中): 组件包括带有铰接安装法兰的压缩成型复合板
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Application No.: US13603552Application Date: 2012-09-05
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Publication No.: US08995138B2Publication Date: 2015-03-31
- Inventor: Darius J. Preisler , Christopher A. Heikkila
- Applicant: Darius J. Preisler , Christopher A. Heikkila
- Applicant Address: US MI Sterling Heights
- Assignee: Global IP Holdings, LLC
- Current Assignee: Global IP Holdings, LLC
- Current Assignee Address: US MI Sterling Heights
- Agency: Brooks Kushman P.C.
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B62D25/20 ; B60R13/00 ; B60R13/01

Abstract:
An assembly including a compression-molded, composite panel with a hinged mounting flange is provided. The panel includes first and second outer layers and a core having first and second portions positioned between the outer layers. The first portion has a large number of cavities and the second portion is substantially free of cavities. The second outer layer is bonded to the core by press molding. The first outer layer includes a first portion bonded to the first portion of the core by press molding and a second portion bonded to the second portion of the core to form the mounting flange pivotally connected to the first portion of the first outer layer. A component is mounted to the flange to pivot with the flange. A living hinge allows the flange and the mounted component to pivot between different use positions relative to the first portion of the first outer layer.
Public/Granted literature
- US20130278018A1 ASSEMBLY INCLUDING A COMPRESSION-MOLDED, COMPOSITE PANEL WITH A HINGED MOUNTING FLANGE Public/Granted day:2013-10-24
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