Invention Grant
- Patent Title: On board wireless module architecture
- Patent Title (中): 板载无线模块架构
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Application No.: US13117991Application Date: 2011-05-27
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Publication No.: US08995144B1Publication Date: 2015-03-31
- Inventor: William Weiser
- Applicant: William Weiser
- Applicant Address: BM Hamilton
- Assignee: Marvell International Ltd.
- Current Assignee: Marvell International Ltd.
- Current Assignee Address: BM Hamilton
- Main IPC: H05K7/00
- IPC: H05K7/00 ; G06F13/40
Abstract:
Embodiments of the present disclosure provide an assembly comprising circuitry of a wireless module disposed on a first region of a circuit board, and circuitry of a host controller module disposed on a second region of the circuit board. The first region is removably coupled to the second region.
Information query
