Invention Grant
- Patent Title: Circuit board unit
- Patent Title (中): 电路板单元
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Application No.: US13504807Application Date: 2010-10-28
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Publication No.: US08995145B2Publication Date: 2015-03-31
- Inventor: Sumio Kagimura , Hiroshi Doumae
- Applicant: Sumio Kagimura , Hiroshi Doumae
- Applicant Address: JP Osaka-Shi, Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka-Shi, Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-248492 20091029
- International Application: PCT/JP2010/006372 WO 20101028
- International Announcement: WO2011/052208 WO 20110505
- Main IPC: H05K3/32
- IPC: H05K3/32 ; H01R4/34 ; H01R12/51 ; H01R12/58 ; H05K1/02 ; H05K1/18
Abstract:
A circuit board unit includes a printed circuit board and a terminal block mounted on the printed circuit board and connecting a power module and an electrical wire together. The terminal block includes a terminal connection part to be directly connected to the power module, and a wire connection part to be connected to the electrical wire. In the printed circuit board, a hole having an orthographic projection area larger than that of the terminal connection part as viewed in plane is formed. The terminal connection part is positioned below or above the hole of the printed circuit board.
Public/Granted literature
- US20120214321A1 CIRCUIT BOARD UNIT Public/Granted day:2012-08-23
Information query
