Invention Grant
- Patent Title: Connection assembly and electronic device
- Patent Title (中): 连接组件和电子设备
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Application No.: US13517551Application Date: 2012-06-13
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Publication No.: US08995147B2Publication Date: 2015-03-31
- Inventor: Lei Liu , Guo-Yi Chen
- Applicant: Lei Liu , Guo-Yi Chen
- Applicant Address: CN Zhongshan
- Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
- Current Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
- Current Assignee Address: CN Zhongshan
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201210024194 20120204
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01R13/70 ; H01R31/06 ; H01R12/71
Abstract:
A connection assembly includes a connection member and a switch. The connection member includes a serial attached small computer system interface (SAS) connector electronically connected to the switch. When the switch is electronically connect to the motherboard, the switch transmits signals from the motherboard to a hard disk drive backplane via the SAS connector. When the switch is electronically connect to the hard disk drive backplane, the switch transmits signals from the hard disk drive backplane to the motherboard via the SAS connector.
Public/Granted literature
- US20130203270A1 CONNECTION ASSEMBLY AND ELECTRONIC DEVICE Public/Granted day:2013-08-08
Information query
