Invention Grant
- Patent Title: Embedded circuit in a MEMS device
- Patent Title (中): MEMS器件中的嵌入式电路
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Application No.: US13755417Application Date: 2013-01-31
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Publication No.: US08995694B2Publication Date: 2015-03-31
- Inventor: Sandra F. Vos , Daniel Giesecke
- Applicant: Knowles Electronics, LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: H04R25/00
- IPC: H04R25/00 ; B81B3/00 ; B81C1/00 ; H04R19/00 ; H04R31/00 ; H01L29/84
Abstract:
A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The output signals of the integrated circuit are routed directly into at least one conductor to access pads at the printed circuit board and the access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface.
Public/Granted literature
- US20130193533A1 EMBEDDED CIRCUIT IN A MEMS DEVICE Public/Granted day:2013-08-01
Information query
