Invention Grant
- Patent Title: Transmission line for an integrated circuit package
- Patent Title (中): 用于集成电路封装的传输线
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Application No.: US13725051Application Date: 2012-12-21
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Publication No.: US08995912B2Publication Date: 2015-03-31
- Inventor: Ahmadreza Rofougaran
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: McDermott Will & Emery LLP
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01P5/18 ; H01L25/00 ; H01P5/04 ; H01Q13/20 ; H01Q13/06 ; H01Q5/00 ; H01P1/18

Abstract:
Communication between chips is provided using a transmission line. Any one of the chips may tap into the transmission line, and communicate with another chip tapped into the transmission line by transmitting a radio frequency (RF) signal to the other chip via the transmission line or receiving an RF signal from the other chip via the transmission line. The transmission line may include a microstrip transmission line, a waveguide, a stripline transmission line, or another type of transmission line. The chips may use the transmission line to communicate data, control and/or clock signals with one another.
Public/Granted literature
- US20140152384A1 TRANSMISSION LINE FOR AN INTEGRATED CIRCUIT PACKAGE Public/Granted day:2014-06-05
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