Invention Grant
- Patent Title: Stacked device detection and identification
- Patent Title (中): 堆叠设备检测和识别
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Application No.: US12641520Application Date: 2009-12-18
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Publication No.: US08996836B2Publication Date: 2015-03-31
- Inventor: Yutaka Ito , Keiichiro Abe
- Applicant: Yutaka Ito , Keiichiro Abe
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F13/00 ; G06F3/00 ; G11C5/04 ; G11C7/20

Abstract:
Various embodiments include apparatus and methods having circuitry to detect and/or assign identification information to dice arranged in a stack and coupled by conductive paths.
Public/Granted literature
- US20110148469A1 STACKED DEVICE DETECTION AND IDENTIFICATION Public/Granted day:2011-06-23
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