Invention Grant
- Patent Title: Tension link for drill floor substructure assembly
- Patent Title (中): 钻台底座组件的张力连接
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Application No.: US13875053Application Date: 2013-05-01
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Publication No.: US08997428B2Publication Date: 2015-04-07
- Inventor: Richard D. Souchek , Keith J. Orgeron
- Applicant: Richard D. Souchek , Keith J. Orgeron
- Applicant Address: US TX Tomball
- Assignee: T&T Enigneering Services, Inc.
- Current Assignee: T&T Enigneering Services, Inc.
- Current Assignee Address: US TX Tomball
- Agency: Scheef & Stone, L.L.P.
- Agent John G. Fischer, Esq.; Jaspal S. Hare, Esq.
- Main IPC: E04B5/02
- IPC: E04B5/02 ; E21B15/00

Abstract:
The present invention relates to a new tension link drill floor level connection system for use on a drilling rig, as may be used in subterranean exploration. The present invention provides a tension link assembly for resisting separating forces incurred between sections of the substructure. In particular, the tension link assembly may be located at the drill floor level for resisting the separating forces imparted by “splayed” or wide leg mast structures that tend to separate substructure side boxes from the substructure center section. The present invention may be comprised of a first link element and a second link element with a tension link being connectable over the first and second link elements to resist separation between sections of the substructure. A latch mechanism may be utilized to prevent upward movement of the tension side boxes or center section relative to the drill floor or to one another.
Public/Granted literature
- US20130291462A1 Tension Link for Drill Floor Substructure Assembly Public/Granted day:2013-11-07
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