A gyroscope having a vibrating structure, produced by micromachining in a thin planar wafer, the gyroscope including two symmetrical moving assemblies that are coupled by a coupling structure connecting the two assemblies so as to allow mechanical vibration energy to be transferred between them, each moving assembly including a first moving element connected to the coupling structure and able to vibrate with two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer, and a second moving element adjacent the first moving element, capable of vibrating only in the Oy direction and connected to the first moving element via linkage element, wherein the linkage element allow the transmission, in phase opposition, to the second moving element of the vibration movement of the first moving element in the Oy direction.