Invention Grant
- Patent Title: Assembly and method for IC unit engagement
- Patent Title (中): 集成电路单元接合的装配和方法
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Application No.: US13518973Application Date: 2010-12-23
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Publication No.: US08997592B2Publication Date: 2015-04-07
- Inventor: Hae Choon Yang , Jong Jae Jung , Deok Chun Jang , Chong Chen Gary Lim
- Applicant: Hae Choon Yang , Jong Jae Jung , Deok Chun Jang , Chong Chen Gary Lim
- Applicant Address: SG Singapore
- Assignee: Rokko Systems Pte Ltd
- Current Assignee: Rokko Systems Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Victor A. Cardona
- Priority: SG200908618-2 20091223
- International Application: PCT/SG2010/000484 WO 20101223
- International Announcement: WO2011/078802 WO 20110630
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65H29/00 ; H05K13/04

Abstract:
A picker assembly includes a plurality of pickers in selective variable spaced relation, a shaft having a plurality of cam plates, the cam plates co-axial with said shaft and having a variable thickness. The cam plates are in engagement with the pickers and positioned in interstitial spaces between the pickers. The selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.
Public/Granted literature
- US20120260752A1 ASSEMBLY AND METHOD FOR IC UNIT ENGAGEMENT Public/Granted day:2012-10-18
Information query
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