Invention Grant
- Patent Title: Thin heat pipe structure and method of manufacturing same
- Patent Title (中): 薄热管结构及其制造方法
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Application No.: US13043484Application Date: 2011-03-09
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Publication No.: US08997839B2Publication Date: 2015-04-07
- Inventor: Hsiu-Wei Yang , Ming-Tai Weng
- Applicant: Hsiu-Wei Yang , Ming-Tai Weng
- Applicant Address: TW New Taipei
- Assignee: Asia Vital Components Co., Ltd.
- Current Assignee: Asia Vital Components Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Nikolai & Mersereau, P.A.
- Agent C. G. Mersereau
- Priority: TW100101753 20110118
- Main IPC: F28D15/00
- IPC: F28D15/00 ; B23P15/26 ; F28D15/04

Abstract:
A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.
Public/Granted literature
- US20120180995A1 THIN HEAT PIPE STRUCTURE AND METHOD OF MANUFACTURING SAME Public/Granted day:2012-07-19
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