Invention Grant
- Patent Title: Wire loop forming systems and methods of using the same
- Patent Title (中): 线环成形系统及其使用方法
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Application No.: US13746489Application Date: 2013-01-22
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Publication No.: US08998063B2Publication Date: 2015-04-07
- Inventor: Jonathan Michael Byars
- Applicant: Orthodyne Electronics Corporation
- Applicant Address: US CA Irvine
- Assignee: Orthodyne Electronics Corporation
- Current Assignee: Orthodyne Electronics Corporation
- Current Assignee Address: US CA Irvine
- Agency: Stradley Konon Stevens & Young, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; B23K31/02 ; H01L21/67 ; B23K35/00 ; H01L23/00 ; B23K20/00
Abstract:
A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.
Public/Granted literature
- US20130200134A1 WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME Public/Granted day:2013-08-08
Information query
IPC分类:
