In accordance with one embodiment of the present disclosure, an apparatus includes a connection body and a connection element arranged at least partially within the connection body. The connection body is operable to couple to a first element in a link arrangement and the connection element is operable to couple to a second element in the link arrangement. The apparatus further includes a metallic spring system arranged circumferentially around at least a portion of the connection element. The metallic spring system is operable to compress in response to relative movement between the connection body and the connection element.