Invention Grant
- Patent Title: Circuits and methods using a non-gold corrosion inhibitor
- Patent Title (中): 使用非金腐蚀抑制剂的电路和方法
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Application No.: US13077123Application Date: 2011-03-31
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Publication No.: US08998384B2Publication Date: 2015-04-07
- Inventor: Lynn Walsh , Mark Walsh , Ronald L. Imken , Soon Yeng Chan , Alejandro Aldrin A. Narag, II
- Applicant: Lynn Walsh , Mark Walsh , Ronald L. Imken , Soon Yeng Chan , Alejandro Aldrin A. Narag, II
- Applicant Address: US TX Houston US TX Austin
- Assignee: Hewlett-Packard Development Company, L.P.,3M Innovative Properties Company
- Current Assignee: Hewlett-Packard Development Company, L.P.,3M Innovative Properties Company
- Current Assignee Address: US TX Houston US TX Austin
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/04 ; B41J2/05 ; B41J2/16 ; B23K1/00 ; B23K1/20
Abstract:
A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.
Public/Granted literature
- US20120249659A1 CIRCUITS AND METHODS USING A NON-GOLD CORROSION INHIBITOR Public/Granted day:2012-10-04
Information query
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