Invention Grant
- Patent Title: Thermal head, printer, and method of manufacturing thermal head
- Patent Title (中): 热敏头,打印机和制造热头的方法
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Application No.: US13722092Application Date: 2012-12-20
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Publication No.: US08998385B2Publication Date: 2015-04-07
- Inventor: Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Norimitsu Sanbongi
- Applicant: Seiko Instruments Inc.
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2011-289962 20111228
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/335

Abstract:
A thermal head including: a laminated substrate including a support substrate and an upper substrate at least one of which has a recess formed in a surface thereof; a heat generating resistor formed on a surface of the upper substrate in the laminated substrate at a position opposed to the recess; and a pair of electrode portions connected to each of both ends of a heat generating resistor, wherein the laminated substrate further includes: an intermediate metal layer sandwiched between the support substrate and the upper substrate and bonded thereto in a laminated state; and a surrounding metal layer formed of a metal material, the surrounding metal layer provided in contact with the intermediate metal layer and formed from a surface of the support substrate extending in a thickness direction thereof to a surface thereof opposite to a portion bonded to the upper substrate.
Public/Granted literature
- US20130169729A1 THERMAL HEAD, PRINTER, AND METHOD OF MANUFACTURING THERMAL HEAD Public/Granted day:2013-07-04
Information query
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