Invention Grant
US08998387B2 Method of working small recess portion, method of fabricating liquid ejection head and liquid ejection head
有权
小凹槽部分的工作方法，液体喷射头和液体喷射头的制造方法
- Patent Title: Method of working small recess portion, method of fabricating liquid ejection head and liquid ejection head
- Patent Title (中): 小凹槽部分的工作方法，液体喷射头和液体喷射头的制造方法
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Application No.: US14097837Application Date: 2013-12-05
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Publication No.: US08998387B2Publication Date: 2015-04-07
- Inventor: Hideyuki Ogawa , Koichi Saito , Nagamitsu Takashima , Katsunori Ono
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-266322 20040914
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/16
Abstract:
The invention is directed to a method of working a small recess portion. In the method, prior to press-forming small recess portions arrayed in a row by pressing a predetermined number of pieces of aligned male dies to a metal base plate, the metal base plate is previously formed with a highly rigid portion at a predetermined portion at a vicinity of an imaginary line extending in a row direction along end portions of predicted press portions to which the respective male dies are pressed.
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