Invention Grant
- Patent Title: Bendable luminous modules and method for producing bendable luminous modules
- Patent Title (中): 弯曲发光模块及其制造方法
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Application No.: US13384541Application Date: 2010-06-16
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Publication No.: US08998450B2Publication Date: 2015-04-07
- Inventor: Thomas Preuschl
- Applicant: Thomas Preuschl
- Applicant Address: DE Munich
- Assignee: OSRAM GmbH
- Current Assignee: OSRAM GmbH
- Current Assignee Address: DE Munich
- Agency: Cozen O'Connnor
- Priority: DE102009032984 20090714
- International Application: PCT/EP2010/058475 WO 20100616
- International Announcement: WO2011/006725 WO 20110120
- Main IPC: F21S4/00
- IPC: F21S4/00 ; F21V21/14 ; H05K1/03 ; H05K3/20 ; H05K1/18 ; F21Y111/00 ; F21S8/08 ; F21W131/103 ; F21Y101/02 ; H05K1/02 ; H05K3/00

Abstract:
A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).
Public/Granted literature
- US20120113606A1 Bendable Luminous Modules and Method for Producing Bendable Luminous Modules Public/Granted day:2012-05-10
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