Invention Grant
US08998561B2 Gripping device, transfer device, processing device, and manufacturing method for electronic device
有权
夹持装置,传送装置,处理装置以及电子装置的制造方法
- Patent Title: Gripping device, transfer device, processing device, and manufacturing method for electronic device
- Patent Title (中): 夹持装置,传送装置,处理装置以及电子装置的制造方法
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Application No.: US13171500Application Date: 2011-06-29
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Publication No.: US08998561B2Publication Date: 2015-04-07
- Inventor: Masaaki Furuya
- Applicant: Masaaki Furuya
- Applicant Address: JP Yokohama
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Yokohama
- Agency: Pearne & Gordon LLP
- Priority: JP2010-152451 20100702; JP2011-134501 20110616
- Main IPC: B25J15/00
- IPC: B25J15/00 ; B25J11/00 ; H01L21/677 ; H01L21/687

Abstract:
According to one embodiment, a gripping device grips a rim of a workpiece by opening and closing gripping plates. The device includes a gripping unit, a hoisting and lowering unit and a motion control unit. The gripping unit includes a first and a second gripping plate. The first gripping plate has a first gripper to contact the rim. The second gripping plate has a second gripper to contact the rim. At least one of the first and second gripping plates is moved and the first and second gripper are spaced from each other. The hoisting and lowering unit is configured to hoist and lower the gripping unit. The motion control unit is configured to control open/close operations and hoisting and lowering operations. The motion control unit mechanically controls first first hoisting and lowering operations, controls second the open/close operations, and controls third second hoisting and lowering operations.
Public/Granted literature
- US20120004773A1 GRIPPING DEVICE, TRANSFER DEVICE, PROCESSING DEVICE, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE Public/Granted day:2012-01-05
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