Invention Grant
- Patent Title: Cooling apparatus for electronic device
- Patent Title (中): 电子设备冷却装置
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Application No.: US13425442Application Date: 2012-03-21
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Publication No.: US08998590B2Publication Date: 2015-04-07
- Inventor: Dai Shintani
- Applicant: Dai Shintani
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Shinjyu Global IP
- Priority: JP2011-063844 20110323; JP2012-027288 20120210
- Main IPC: F04D33/00
- IPC: F04D33/00 ; H05K7/20

Abstract:
A cooling apparatus includes a base member, a flat piezoelectric actuator, at least one expansion mechanism, and a blade member. The flat piezoelectric actuator is configured to be connected at one end to the base member. At least one expansion mechanism is configured to be connected to the other end of the piezoelectric actuator and pivot by the swinging of the piezoelectric actuator. The blade member is configured to be connected to the expansion mechanism and swing by the pivoting of the expansion mechanism. The blade member performs a fanning action by the swinging of the piezoelectric actuator and the pivoting of the expansion mechanism if AC power is applied to the piezoelectric actuator.
Public/Granted literature
- US20120244024A1 COOLING APPARATUS FOR ELECTRONIC DEVICE Public/Granted day:2012-09-27
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