Invention Grant
- Patent Title: Injection mold
- Patent Title (中): 注塑模具
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Application No.: US13712264Application Date: 2012-12-12
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Publication No.: US08998604B2Publication Date: 2015-04-07
- Inventor: Hak Do Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2011-0132843 20111212
- Main IPC: B29C45/42
- IPC: B29C45/42 ; B29C45/17 ; B29C45/40

Abstract:
An injection mold including a first mold, a second mold disposed opposite to the first mold and configured to form a cavity having a shape that corresponds to an injection-molded product to be manufactured by being coupled to the first mold, an injection apparatus configured to inject molten resin in the cavity, and an adsorption apparatus configured to adsorb and separate the injection-molded product, which is manufactured by the first mold and the second mold, from the first mold, so that the separation of the injection-molded product is performed by the adsorption apparatus, and thus structures configured to separate the injection-molded product are omitted from the first mold and the second mold, thereby simplifying the structures of the first mold and the second mold.
Public/Granted literature
- US20130149409A1 INJECTION MOLD Public/Granted day:2013-06-13
Information query
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