Invention Grant
- Patent Title: High current female electrical contact assembly
- Patent Title (中): 大电流母接触组件
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Application No.: US13325470Application Date: 2011-12-14
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Publication No.: US08998657B1Publication Date: 2015-04-07
- Inventor: Kurt Von Eckroth , Neil A. Czarnecki
- Applicant: Kurt Von Eckroth , Neil A. Czarnecki
- Applicant Address: US WI Racine
- Assignee: Reliance Controls Corporation
- Current Assignee: Reliance Controls Corporation
- Current Assignee Address: US WI Racine
- Agency: Boyle Frederickson, S.C.
- Main IPC: H01R11/22
- IPC: H01R11/22 ; H01R13/11 ; H01R13/193

Abstract:
An electrical connection device has a first end and a second end configured to be electrically coupled to a first conductor and a second conductor. A pair of conductive elements are arranged between the first end and the second end and configured for engagement with the first and second conductors. The conductive elements include a respective flat segment and a bent segment. The bent segments define an opening in which one of the first and second conductors are configured to be received. The bent segments include a number of corners configured to engage opposing sides of the one of the first and second conductors at a number of discrete points along at least a portion of the length of the at least one first and second conductors.
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