Invention Grant
- Patent Title: Crimping terminal
- Patent Title (中): 压接端子
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Application No.: US13856858Application Date: 2013-04-04
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Publication No.: US08998659B2Publication Date: 2015-04-07
- Inventor: Kei Sato , Shinji Kodama
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2010-227479 20101007
- Main IPC: H01R4/10
- IPC: H01R4/10 ; H01R4/18 ; H01R4/62 ; H01R4/70
Abstract:
A first member including an electric connection portion and a second member including an electric wire connecting portion are joined together. The first member and the second member are made of dissimilar metal materials. Joined portions of the first member and the second member are covered with a resin mold portion.
Public/Granted literature
- US20130231013A1 CRIMPING TERMINAL Public/Granted day:2013-09-05
Information query
