Invention Grant
- Patent Title: Machine tool including tool radius adjusting device
- Patent Title (中): 机床包括刀具半径调节装置
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Application No.: US13217555Application Date: 2011-08-25
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Publication No.: US08998785B2Publication Date: 2015-04-07
- Inventor: Eiji Nakamura , Akihiko Kadota , Takashi Yokoyama
- Applicant: Eiji Nakamura , Akihiko Kadota , Takashi Yokoyama
- Applicant Address: JP Osaka-shi
- Assignee: JTEKT Corporation
- Current Assignee: JTEKT Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-199116 20100906
- Main IPC: B23Q3/157
- IPC: B23Q3/157 ; B23B29/034

Abstract:
A tool radius adjusting device executes an operation for adjusting the tool radius of a boring holder in parallel with execution of a machining program for executing an operation of a spindle head and an operation of a tool changer. A carrier control unit determines whether the tool changer is executing a tool changing process. When the tool changing process is not being executed, the carrier control unit allows the carrier device to execute an operation for picking the boring holder out from the tool magazine and an operation for returning the boring holder, of which the tool radius has been adjusted, to the tool magazine.
Public/Granted literature
- US20120058871A1 MACHINE TOOL INCLUDING TOOL RADIUS ADJUSTING DEVICE Public/Granted day:2012-03-08
Information query
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