Invention Grant
- Patent Title: Assembly tool for modular implants, kit and associated method
- Patent Title (中): 用于模块化植入物,套件和相关方法的装配工具
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Application No.: US11541184Application Date: 2006-09-29
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Publication No.: US08998919B2Publication Date: 2015-04-07
- Inventor: Michael C. Jones , David W. Daniels , John D. Emenhiser
- Applicant: Michael C. Jones , David W. Daniels , John D. Emenhiser
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Agency: Maginot, Moore & Beck, LLP
- Main IPC: A61B17/60
- IPC: A61B17/60 ; A61F2/46 ; A61B17/16 ; A61F2/36 ; A61F2/30

Abstract:
An assembly tool for assembly of a first component of a prosthesis to a second component of the prosthesis for use in joint arthroplasty is provided. The tool includes a first member in contact with the first component and a second member connected to the second component. The first member defines a first member longitudinal axis. The first member and the second member provide for the assembly of the first component of the prosthesis to the second component of the prosthesis. The second member provides relative motion of the second member with respect to the first member when the second member is rotated relative to the first member about the first member longitudinal axis. The first member and the second member have relative motion features adapted to reduce friction that cooperate with each other to provide the relative motion of the first member with respect to the second member.
Public/Granted literature
- US20070123908A1 Assembly tool for modular implants, kit and associated method Public/Granted day:2007-05-31
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