Invention Grant
- Patent Title: Orthopedic implant with porous polymer bone contacting surface
- Patent Title (中): 骨科植入物与多孔聚合物骨接触面
-
Application No.: US13884171Application Date: 2011-11-11
-
Publication No.: US08998987B2Publication Date: 2015-04-07
- Inventor: Michael Wallick
- Applicant: Michael Wallick
- Applicant Address: US IN Warsaw
- Assignee: Zimmer, Inc.
- Current Assignee: Zimmer, Inc.
- Current Assignee Address: US IN Warsaw
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2011/060379 WO 20111111
- International Announcement: WO2012/065068 WO 20120518
- Main IPC: A61F2/28
- IPC: A61F2/28 ; A61F2/36 ; A61F2/30

Abstract:
The present disclosure relates to orthopedic implants including a porous, non-metallic, bone interface or outer bone contacting surface adapted for promoting bone ingrowth into the pores of such surface. The present disclosure also relates to orthopedic implants having a porous, non-metallic and/or polymeric bone interface or outer bone contacting surface wherein the implant has a stiffness that approaches or substantially matches the stiffness of the surrounding bone and thereby reduces the effects of stress shielding. The present disclosure also relates to methods of making such implants.
Public/Granted literature
- US20130345827A1 ORTHOPEDIC IMPLANT WITH POROUS POLYMER BONE CONTACTING SURFACE Public/Granted day:2013-12-26
Information query
IPC分类: