Invention Grant
- Patent Title: Susceptor, semiconductor manufacturing apparatus, and semiconductor manufacturing method
- Patent Title (中): 受体，半导体制造装置和半导体制造方法
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Application No.: US12434317Application Date: 2009-05-01
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Publication No.: US08999063B2Publication Date: 2015-04-07
- Inventor: Hideki Ito
- Applicant: Hideki Ito
- Applicant Address: JP Shizuoka
- Assignee: NuFlare Technology, Inc.
- Current Assignee: NuFlare Technology, Inc.
- Current Assignee Address: JP Shizuoka
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2008-120159 20080502
- Main IPC: C23C16/50
- IPC: C23C16/50 ; C23C16/00 ; C23F1/00 ; H01L21/306 ; C23C16/458 ; C23C16/46 ; C30B25/12 ; H01L21/687
Abstract:
A susceptor includes a first step portion on which a wafer is placed; and a convex portion placed on a bottom surface of the first step portion, wherein a void is formed between a top surface of the convex portion and a rear surface of the wafer in a state in which the wafer is placed on the top surface of the convex portion.
Public/Granted literature
- US20090272323A1 SUSCEPTOR, SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR MANUFACTURING METHOD Public/Granted day:2009-11-05
Information query
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