In the vacuum substrate processing equipment of the present invention, a posttreatment chamber for carrying out a posttreatment in an atmospheric atmosphere adjoins a load-lock chamber. Products produced on a substrate during a vacuum process are removed by processing the substrate in the posttreatment chamber before the substrate is carried to an atmospheric carrying chamber in order to avoid or reduce adverse influence on the atmospheric carrying chamber. A carrying means installed in the said atmospheric carrying chamber carries the substrate to and from the said posttreatment chamber. The said posttreatment chamber and the atmospheric carrying chamber are separated from each other by a partition wall, and the partition wall is provided with an opening having the shape of a slit through which the said carrying means and the substrate can pass. The said carrying means carries the substrate into and out of the posttreatment chamber through the slit.