Invention Grant
- Patent Title: Laser ashing of polyimide for semiconductor manufacturing
- Patent Title (中): 用于半导体制造的聚酰亚胺的激光灰化
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Application No.: US13285408Application Date: 2011-10-31
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Publication No.: US08999107B2Publication Date: 2015-04-07
- Inventor: Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
- Applicant: Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Steven Meyers; L. Jeffrey Kelly
- Priority: CA2719927 20101105
- Main IPC: B32B38/10
- IPC: B32B38/10 ; H01L21/301 ; H01L21/02 ; B08B7/00 ; B23K26/40 ; H01L21/311 ; H01L23/00
Abstract:
A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
Public/Granted literature
- US20120111496A1 LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING Public/Granted day:2012-05-10
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